Products
Applicable industry: semiconductor (for vacuum chuck for wafer holding)
Rotary Joint
MFC1P series (single-port)
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Applications
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Air supply for wafer pressurization
-
Vacuum chuck for wafer holding
Features
-
Low heat generation and minimal dust emission thanks to the clearance seal
Specifications
| Max. speed | 6,000 min-1 / rpm |
| Pressure | -0.1~0.5 MPa / -14.5~72.5 psi / -1~5 bar (*1) |
| Fluid | Vacuum / Air |
| Material |
SUS and more |
*1 Pressure retention is not possible due to the clearance seal.
The achievable vacuum level depends on the performance of the vacuum pump.
The above specifications are for reference only.
Actual specifications may vary depending on the model.
MFC series (multi-port)
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Applications
-
Air supply for wafer pressurization
-
Vacuum chuck for wafer holding
Features
-
Low heat generation and minimal dust emission thanks to the clearance seal
Specifications
| Max. speed | 3,000 min-1 / rpm |
| Pressure | -0.1~0.5 MPa / -14.5~72.5 psi / -1~5 bar (*1) |
| Fluid | Vacuum / Air |
| Material |
SUS and more |
*1 Pressure retention is not possible due to the clearance seal.
The achievable vacuum level depends on the performance of the vacuum pump.
The above specifications are for reference only.
Actual specifications may vary depending on the model.
Catalog download
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ROTARY JOINTS for semiconductor
Catalog
Rotary Joint