|
 |
|
 |
|
 |
|
| Description |
Spin Jet Type Flux Cleaning Equipment |
| Application |
WL-CSP, System LSI, Wafer |
| Series |
JS |
|
 |
Outline
This equipment provided with a single wafer transfer system is
used to remove the flux from bumped wafers.
The "SPIN-JET" ensures the removal of flux and foreign objects
from the surface of the wafers. |
|
| Features |
- The difference of cleaning performance
Boundary layer exist on surface of wafer in liquid. It makes stagnation and spoils cleaning power of high speed flow. For this reason, cleaning performance of conventional method is not satisfied.
- A jet reaches the surface of wafer directly in the air. And remove the flux and micro solder balls. Also, since the wafer is rotated at that time, the problem of re-adhesion has been successfully solved.
- Spin chuck table has five fingers. The fingers with counter-balancer are not affected by centrifugal force of high speed spinning. The fingers chuck only outside of wafer.
The both side of wafer is cleaned -up at the same time.
|
|
|
|
|
