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| Description |
Waterjet Deflashing Equipment |
| Application |
QFN, TSOP, DISCRETA,TRANSISTOR, IC, LEADFRAME |
| Series |
AX, EWJ |
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Waterjet Deflashing Equipment
The AX series of deflashing systems clean unwanted resin adhesions resin bleed from integrated circuit leadframes, diodes and transistors by means of precise high pressure waterjets. They are also effective for removing resin flash from laminated press plate jigs which are to be used to manufacture laminated circuit boards.
Pre-treatment (electrolysis) + waterjet inline system is available if it's difficult to deflash by waterjet only. |
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| Features |
- The AX-300 series which removes resin bleed, are suitable for
IC or discrete.
- Two types of cleaning nozzle are provided;
Eccentric rotary nozzle (HY-type) which widely hits total surface
of leadframe.
- The pump was selected because of its high operation reliability
and ease of maintenance. It is a 150Mpa continuously discharging
plunger pump.
- Fully automatic operation is an available option.
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